Merge pull request #365 from aitomatic/examples/semiconductor-etching-yieldguard

add examples/semiconductor-etching-yieldguard

Author: TheVinhLuong102

examples/semiconductor-etching-yieldguard/.env.template

@@ -0,0 +1,2 @@
+HF_API_KEY=[... HuggingFace API key if running HuggingFace-hosted models ...]
+OPENAI_API_KEY=[... OpenAI API key if running on OpenAI services ...]

examples/semiconductor-etching-yieldguard/.gitignore

@@ -0,0 +1,5 @@
+# environment variables
+.env
+
+# Streamlit secrets
+.streamlit/secrets.toml

examples/semiconductor-etching-yieldguard/.streamlit/secrets.toml.template

@@ -0,0 +1,2 @@
+HF_API_KEY = '[... HuggingFace API key if running HuggingFace-hosted models ...]'
+OPENAI_API_KEY = '[... OpenAI API key if running on OpenAI services ...]'

examples/semiconductor-etching-yieldguard/Makefile

@@ -0,0 +1,2 @@
+streamlit-run:
+	@poetry run streamlit run streamlit-main.py --server.allowRunOnSave=true --server.runOnSave=true

examples/semiconductor-etching-yieldguard/README.md

@@ -0,0 +1,16 @@
+<!-- markdownlint-disable MD013 MD043 -->
+
+# Semiconductor Etching YieldGuard
+
+## How to Run This Example
+
+Install OpenSSA repo beforehand by running `make install` (or `.\make install` on Windows)
+at the OpenSSA repo root directory.
+
+In this example's directory:
+
+- Necessary credentials need to be in the `.env` file
+
+- DANA problem-solving can be run by `make dana-solve prob="..."` (or `.\make dana-solve "..."` on Windows)
+
+- Streamlit app can be run by `make streamlit-run` (or `.\make streamlit-run` on Windows)

examples/semiconductor-etching-yieldguard/YieldGuard.png

@@ -0,0 +1,65 @@
+from argparse import ArgumentParser
+from functools import cache
+from pathlib import Path
+
+from dotenv import load_dotenv
+import yaml
+
+from openssa import DANA, ProgramStore, HTP, HTPlanner, FileResource, HuggingFaceLM
+
+# pylint: disable=wrong-import-order
+from semikong_lm import SemiKongLM
+
+
+load_dotenv()
+
+
+BASE_DIR: Path = Path(__file__).parent
+
+DATA_DIR_PATH: Path = BASE_DIR / 'data'
+
+EXPERTISE_DIR_PATH: Path = BASE_DIR / 'expertise'
+
+EXPERT_KNOWLEDGE_FILE_PATH: Path = EXPERTISE_DIR_PATH / 'expert-knowledge.txt'
+with open(file=EXPERT_KNOWLEDGE_FILE_PATH,
+          buffering=-1,
+          encoding='utf-8',
+          errors='strict',
+          newline=None,
+          closefd=True,
+          opener=None) as f:
+    EXPERT_KNOWLEDGE: str = f.read()
+
+EXPERT_PROGRAMS_FILE_PATH: Path = EXPERTISE_DIR_PATH / 'expert-programs.yml'
+with open(file=EXPERT_PROGRAMS_FILE_PATH,
+          buffering=-1,
+          encoding='utf-8',
+          errors='strict',
+          newline=None,
+          closefd=True,
+          opener=None) as f:
+    EXPERT_PROGRAMS: dict[str, dict] = yaml.safe_load(stream=f)
+
+
+@cache
+def get_or_create_dana(use_semikong_lm: bool = True, max_depth=2, max_subtasks_per_decomp=4) -> DANA:
+    lm = (SemiKongLM if use_semikong_lm else HuggingFaceLM).from_defaults()
+
+    program_store = ProgramStore(lm=lm)
+    if EXPERT_PROGRAMS:
+        for program_name, htp_dict in EXPERT_PROGRAMS.items():
+            htp = HTP.from_dict(htp_dict)
+            program_store.add_or_update_program(name=program_name, description=htp.task.ask, program=htp)
+
+    return DANA(knowledge={EXPERT_KNOWLEDGE},
+                program_store=program_store,
+                programmer=HTPlanner(lm=lm, max_depth=max_depth, max_subtasks_per_decomp=max_subtasks_per_decomp),
+                resources={FileResource(path=DATA_DIR_PATH, re_index=True)})
+
+
+if __name__ == '__main__':
+    arg_parser = ArgumentParser()
+    arg_parser.add_argument('problem')
+    args = arg_parser.parse_args()
+
+    print(get_or_create_dana().solve(problem=args.problem))

examples/semiconductor-etching-yieldguard/dana.py

@@ -0,0 +1,11 @@
+WaterBatch: 1, 2, 3, 4, 5, 6
+
+ReflectedPower_W: 36.6, 35.4, 37.5, 40.1, 42.3, 37.9
+
+ForwardPower_W: 60.0, 58.0, 58.2, 57.8, 65.3, 60.0
+
+ChamberPressure_Torr: 3.89, 4.18, 3.85, 4.22, 4.25, 3.53
+
+GasFlowRate_sccm: 59.7, 58.1, 56.2, 55.1, 59.7, 54.4
+
+ChamberWallTemperature_C: 76.3, 78.3, 76.6, 79.6, 81.7, 81.9

examples/semiconductor-etching-yieldguard/data/measurement-data.txt

@@ -0,0 +1,93 @@
+SEMICONDUCTOR ETCHING EQUIPMENT MONITORING, MAINTENANCE & OPTIMIZATION
+======================================================================
+
+
+RF Power Fluctuation Rule
+-------------------------
+HEURISTIC: If the reflected power in the TEL Tactras RLSA Etcher increases by more than 5% for three consecutive wafers,
+and the forward power adjustment exceeds 10%, this suggests possible electrode erosion or plasma instability.
+
+ACTION: Alert the maintenance engineer to inspect the electrodes and adjust gas flow or power settings,
+potentially avoiding costly equipment downtime.
+
+
+Pressure Stability Monitoring
+-----------------------------
+HEURISTIC: If the chamber pressure deviation exceeds ±3% for more than 30 seconds during steady-state etching,
+coupled with a gas flow variation of more than 5%, it indicates potential chamber wall coating or residue buildup.
+
+ACTION: Recommend a preventative chamber clean and adjust the gas flow to stabilize pressure,
+reducing the likelihood of non-uniform etching.
+
+
+Temperature-Dependent Chamber Cleaning Optimization
+---------------------------------------------------
+HEURISTIC: If the chamber wall temperature shows a steady increase of 2°C over three lots,
+despite maintaining the same power settings, it indicates polymer build-up on the chamber walls.
+
+ACTION: Suggest adjusting the chamber clean cycle frequency and alerts engineers to check the wall lining.
+Automated cleaning recommendations can significantly reduce variation and increase yield.
+
+
+Etch Rate Uniformity Rule
+-------------------------
+HEURISTIC: If the etch rate between the wafer center and edge varies by more than 7% for three consecutive lots,
+this could indicate gas flow distribution issues or hardware alignment issues within the TEL Tactras system.
+
+ACTION: Alert the process engineer to investigate gas flow uniformity
+and suggests optimizing flow parameters or performing a hardware realignment.
+
+
+Chamber Matching Network Heuristic
+----------------------------------
+HEURISTIC: If the chamber matching network requires more than two adjustments per wafer run
+to maintain desired RF power settings, it suggests possible impedance mismatch or degradation in the matching components.
+
+ACTION: Optimize matching network settings and recommend maintenance
+if impedance mismatch trends persist, potentially preventing plasma stability issues.
+
+
+Microloading Effect Detection
+-----------------------------
+HEURISTIC: If the etch rate is higher in areas with smaller feature densities compared to high-density areas
+(indicative of the microloading effect), and the difference exceeds a set threshold,
+this can lead to non-uniform etching and yield loss.
+
+ACTION: Alert engineers to optimize gas flow and power settings based on specific wafer feature density,
+enhancing etch uniformity across wafers.
+
+
+Real-Time Recipe Adjustment Based on Yield Data
+-----------------------------------------------
+HEURISTIC: If yield data shows a consistent defect pattern (e.g., at the wafer edge or specific die locations)
+for more than 5% of wafers, correlate this with historical process parameters and makes real-time recipe adjustments.
+
+ACTION: Automated recipe optimization based on yield trends can reduce defect occurrence,
+improving overall productivity and wafer quality.
+
+
+Anomaly Detection with Historical Baseline Comparison
+-----------------------------------------------------
+HEURISTIC: If real-time sensor data (e.g., temperature, pressure, RF power) shows deviations
+outside historical baseline ranges for similar recipes, this could indicate tool degradation or unexpected chamber behavior.
+
+ACTION: Trigger alerts and suggest corrective actions such as parameter adjustment or additional inspections,
+preventing potential faults.
+
+
+Particle Generation Control for Bevel Etching
+---------------------------------------------
+HEURISTIC: If particle count in the bevel area increases beyond acceptable limits during bevel etching
+in the Tactras UDEMAE system, this suggests non-uniform edge plasma distribution or excessive material removal.
+
+ACTION: Recommend reducing RF power or modifying gas flow in the bevel area,
+significantly reducing the risk of yield-impacting particle contamination.
+
+
+Multi-Parameter Fault Isolation for Complex Equipment
+-----------------------------------------------------
+HEURISTIC: If multiple parameters (e.g., RF power, pressure, temperature) show simultaneous deviations
+outside standard operating windows, use historical fault isolation data to pinpoint the most likely root cause.
+
+ACTION: Provide a ranked list of potential root causes with confidence levels,
+enabling faster and more accurate fault isolation.

examples/semiconductor-etching-yieldguard/expertise/expert-knowledge.txt

@@ -0,0 +1,72 @@
+rf-power-fluctuation-monitoring:
+  task: |-
+    Monitor RF Power fluctuation and recommend inspection/maintenance actions if fluctuation is excessive
+
+  sub-htps:
+    - task: >-
+        What are the values of Reflected Power in the recent data?
+
+    - task: |-
+        Analyze whether the lowest and highest Reflected Power values differ by more than 15%.
+        If so, note down the corresponding wafer batch number range between them.
+
+    - task: >-
+        What are the values of Forward Power in the recent data?
+
+    - task: |-
+        Analyze whether the lowest and highest Forward Power values differ by more than 10%.
+        If so, note down the corresponding wafer batch number range between them.
+
+    - task: |-
+        If there are excessive fluctuations in both Reflected Power and Forward Power in the previous analyses,
+        and if the wafer batch number ranges overlap, report a RF Power Fluctuation problem,
+        and recommend the following maintenance actions:
+        - Inspect the electrodes
+        - Adjust gas flow
+        - Adjust power settings
+
+
+pressure-instability-monitoring:
+  task: |-
+    Monitor Chamber Pressure fluctuation and recommend inspection/maintenance actions if fluctuation is excessive
+
+  sub-htps:
+    - task: >-
+        What are the values of Chamber Pressure in the recent data?
+
+    - task: |-
+        Analyze whether there are consecutive Chamber Pressure values differing by at least 3%.
+        If so, note down the corresponding wafer batch numbers.
+
+    - task: >-
+        What are the values of Gas Flow Rate in the recent data?
+
+    - task: |-
+        Analyze whether there are consecutive Gas Flow Rate values differing by at least 5%.
+        If so, note down the corresponding wafer batch numbers.
+
+    - task: |-
+        If there are excessive fluctuations in both Chamber Pressure and Gas Flow Rate in the previous analyses,
+        and if the wafer batch numbers contain some same batch(es), report a Pressure Instability problem,
+        and recommend the following maintenance actions:
+        - Preventative chamber cleaning
+        - Adjustment of the gas flow to stabilize pressure
+
+
+chamber-temperature-monitoring:
+  task: |-
+    Monitor Chamber Temperature increases and recommend inspection/maintenance actions if heating is excessive
+
+  sub-htps:
+    - task: >-
+        What are the values of Chamber Temperature in the recent data?
+
+    - task: |-
+        Analyze whether there are 3 consecutive Chamber Temperature values
+        showing increases of at least 2 Celcius degrees from first to second and from second to third
+
+    - task: |-
+        If there is/are significant Chamber Temperature increase(s) identified in the previous analysis,
+        recommend the following maintenance actions:
+        - Adjustment of chamber clean frequency
+        - Alerting engineers to check wall lining for polymer build-up

examples/semiconductor-etching-yieldguard/expertise/expert-programs.yml

@@ -0,0 +1,20 @@
+@echo off
+
+
+:: TARGETS
+:: =======
+SET TARGET=%1
+
+IF "%TARGET%"=="streamlit-run" GOTO streamlit-run
+
+
+:: STREAMLIT APP
+:: =============
+:streamlit-run
+  poetry run streamlit run streamlit-main.py --server.allowRunOnSave=true --server.runOnSave=true
+  GOTO end
+
+
+:: END
+:: ===
+:end

examples/semiconductor-etching-yieldguard/make.bat

@@ -0,0 +1,7 @@
+WaterBatch,ForwardPower_W,ReflectedPower_W,ChamberPressure_Torr,GasFlowRate_sccm,ChamberWallTemperature_C
+1,59.8658484197038,36.58009357302478,3.8912139968434072,59.656320330745594,76.29389990800009
+2,58.16704785825934,35.38252446429568,4.178602163853312,58.08397348116461,78.31261142176992
+3,58.166955288079336,37.50547593215342,3.850684781489443,56.22890595323773,76.55855538044706
+4,57.79118453875756,40.13085924740417,4.2179458479297685,55.054858831268945,79.60034010588906
+5,65.30403852879604,42.33805650601139,4.250891926683164,59.68444677837765,81.7335513967164
+6,59.87527628850847,37.941053938071626,3.5335182210508873,54.40152493739601,81.92427227762764

examples/semiconductor-etching-yieldguard/measurements.csv

@@ -0,0 +1 @@
+OpenSSA[contrib] @ https://GitHub.com/Aitomatic/OpenSSA/archive/main.zip

examples/semiconductor-etching-yieldguard/requirements.txt

@@ -0,0 +1,30 @@
+from __future__ import annotations
+
+from argparse import ArgumentParser
+from dataclasses import dataclass
+
+from openssa.core.util.lm.llama import LlamaLM
+
+
+DEFAULT_MODEL = 'pentagoniac/SEMIKONG-70B'
+DEFAULT_API_KEY = '...'
+DEFAULT_API_BASE = 'http://34.44.90.64:8081/v1'
+
+
+@dataclass
+class SemiKongLM(LlamaLM):
+    """SemiKong LM."""
+
+    @classmethod
+    def from_defaults(cls) -> SemiKongLM:
+        """Get default SemiKong LM instance."""
+        # pylint: disable=unexpected-keyword-arg
+        return cls(model=DEFAULT_MODEL, api_key=DEFAULT_API_KEY, api_base=DEFAULT_API_BASE)
+
+
+if __name__ == '__main__':
+    arg_parser = ArgumentParser()
+    arg_parser.add_argument('question')
+    args = arg_parser.parse_args()
+
+    print(SemiKongLM.from_defaults().get_response(prompt=args.question))